MC3D

MC3D Series Metallized Polypropylene DC-Link Film Capacitors

Rated voltage500–1,200 VDC
Capacitance2–180 µF
Tolerance±5% / ±10%
Operating temperature−40 °C to +105 °C
Lead pitch27.5 / 37.5 / 52.5 mm
Dissipation factortan δ ≤0.2% at 1 kHz

Boxed metallized polypropylene DC-link film capacitors for DC-bus filtering and energy storage in converters. 500–1,200 VDC, 2–180 µF, −40 °C to +105 °C.

Series product photograph
Series product photograph

Part numbers

20

Showing 20 of 20 part numbers

3D1U126KV1B0320330180EVT
3D1U205KV1B0315220130EVT
3D1U335KV1B0320200110EVT
3D1V405KV1A5310250150EVT
3D1X105KV1A5315200110EVT
3D1X106KV1B0320370220EET
3D1X106KV1B0320370220EVT
3D1X855KV1B0320330180EVT
3D1Y104KQ135180210120EVT
3D1Y205KV135315250150EVT
3D1Y205KV1A5315250150EVT
3D1Y205KV1B0315250150EVT
3D1Y206KLMB0420450300EVT
3D1Y505KV1A5315250150EVT
3D2E335JV1B0315200110EVT
3D2H206KV150320370220EV0
3D2K106KV1B0320370220EVT
3D2K306KLMB0420450300EVT
3D2K505KV150310330180EVT
3D2K505KV150320330180EVT

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Datasheets & approval documents

Datasheets, technical documents and approval certificates for this series. English editions of documents marked “Chinese” are available on request.

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Engineering details

Overview

Boxed metallized polypropylene DC-link film capacitors with self-healing construction for DC-bus filtering and energy storage in converters, industrial power supplies and renewable-energy inverters. Rated 500–1,200 VDC; 2–180 µF, maximum value depending on voltage; tolerance ±5% or ±10%. Operating temperature −40 °C to +105 °C, voltage derating above +85 °C. Lead pitch 27.5, 37.5 or 52.5 mm; two- or four-pin PCB mounting.

Series features

  • Self-healing metallized polypropylene construction for DC filtering
  • Rated 500–1,200 VDC, 2–180 µF, lead pitch 27.5, 37.5 or 52.5 mm
  • Two- and four-pin PCB versions; other terminal styles on request
  • Operating temperature −40 °C to +105 °C; voltage derating above +85 °C
Specifications
Component functionPCB-mount metallized polypropylene DC-link capacitor for DC filtering and energy storage · not an X/Y safety capacitor · not for reflow soldering
ConstructionMetallized polypropylene film · self-healing · plastic box encapsulation
Standards and approvalsNo IEC 61071, IEC 60384, AEC-Q200 or agency approval is specified for this series; qualification data on request
Rated DC voltage500 · 600 · 800 · 900 · 1,000 · 1,200 VDC
Capacitance range2–180 µF · J ±5% or K ±10%; the maximum value depends on rated voltage
Maximum capacitance per voltage1,200 V: 25 µF · 1,000 V: 70 µF · 800/900 V: 95 µF · 600 V: 110 µF · 500 V: 180 µF
Stored energyE = ½CV²; 22.5 J at 180 µF / 500 V and 18 J at 25 µF / 1,200 V. Provide discharge and touch protection in the equipment.
Capacitance tolerance±5% (J) · ±10% (K)
Operating temperature−40 °C to +105 °C
Voltage deratingVRDC reduced by 1.25 percentage points per °C from +85 °C to +105 °C; derating curve and hot-spot definition on request
Climatic category40/85/56; does not define humidity performance under DC bias (THB)
Dissipation factortan δ ≤0.2% at 1 kHz, 1.0 Vrms, 20 °C
Insulation resistance≥10,000 MΩ at 100 VDC, 60 s, 20 °C
Voltage proof, terminal to terminal1.5 × UR, 10 s
Lead pitchV 27.5 · L 37.5 · I 52.5 mm; pitch depends on rated voltage and capacitance
Body dimensionsW 31–58 · H 20–65 · T 11–45 mm, ±0.5 mm; case depends on rated voltage and capacitance
Lead diameter0.8 / 1.0 / 1.2 mm ±0.05 mm, by case and pitch
Terminal stylesE single terminal · F double terminal · K upright screw terminal · M four-pin lead. Datasheet drawings cover two- and four-pin PCB versions; drawings for other styles on request.
Lead lengthCut to customer requirement · ±0.5 mm for 5–9 mm · ±1.0 mm for 10–20 mm
Case materialPlastic case
Hand soldering / reworkIron ≤350 °C · ≤3 s · ≥2 mm from the case
Reflow solderingNot permitted; wave-soldering profile on request
Storage≤35 °C · ≤70% RH · unopened original package · max. 12 months
Storage atmosphereProtect terminals from hydrogen chloride, hydrogen sulfide and sulfurous atmospheres, which can degrade solderability
Further dataOn request: metallization and internal construction · permissible Irms versus frequency and ambient temperature, ripple-voltage limit and temperature-rise criterion · ESR, tan δ versus frequency, thermal resistance, hot-spot location and self-heating limit · dV/dt, peak current, pulse energy, short-circuit and failure-mode data · ESL, impedance curve and self-resonant frequency, two-pin versus four-pin · expected life versus voltage, hot-spot temperature and ripple current, FIT rate and end-of-life criteria · THB, damp-heat, altitude, corrosion, thermal-cycling and salt-mist data · mass, board-retention, vibration, lead-current-sharing and torque data · flammability rating and material declarations · loaded-life, ripple-endurance, surge, self-healing, shock, lead-strength, soldering and flame test data
Variants

Ranges by dielectric, package and lead style within this series.

VariantBody dimensionsRated voltage / capacitanceDielectric / tolerance / packageLead / land patternNotes
V · 27.5 mmW 31–32 · H 20–37 · T 11–22 mm500–1,200 VDC · lower-energy valuesMetallized PP · J/K · boxed DC-link constructionP 27.5 ±1.0 · d 0.8–1.0 ±0.05 mmCompact PCB case. Do not extrapolate Irms, ESR, thermal or life data from case size.
L · 37.5 mmW 41.5 · H 28–55 · T 14–40 mm500–1,200 VDC · medium-energy valuesMetallized PP · J/K · two- or four-pinP 37.5 ±1.0 · d 1.0–1.2 ±0.05 mmMedium current and energy. Terminal layout, support and current sharing per the part drawing.
I · 52.5 mmW 58 · H 43.5–65 · T 29.5–45 mm500–1,200 VDC · higher-energy values; 500 V reaches 180 µFMetallized PP · J/K · two- or four-pinP 52.5 ±1.0 · d 1.0–1.2 ±0.05 mmHighest energy. Validate board support, discharge, Irms, hot spot, vibration and life in the application.
Selection guide

Start with the converter mission profile, not only bus voltage and capacitance. Coordinate steady-state and transient voltage, stored energy, ripple spectrum, ESR/ESL, hot-spot temperature, cooling, humidity, altitude, lifetime, discharge safety and two- or four-pin mechanics.

  1. Define bus, ripple and mission profile

    Define nominal and maximum DC bus voltage, switching and low-frequency ripple spectra, regenerative or fault overvoltage, precharge and discharge behavior, ambient temperature and cooling, altitude, humidity, vibration and the lifetime histogram.

  2. Select a voltage and capacitance combination

    Select from the voltage/capacitance table in the datasheet and observe the maximum capacitance at each voltage. The 2–180 µF series range does not apply at every voltage.

  3. Calculate current, loss and hot spot

    Calculate harmonic Irms and energy E = ½CV², and check them against the part's ESR versus frequency and temperature, ESL and resonance, Irms, ripple-voltage, terminal-current, Rth, hot-spot and self-heating limits (on request).

  4. Apply voltage derating and a life model

    Apply the voltage derating above +85 °C and a life model based on voltage, hot spot, ripple, humidity and altitude. THB, loaded and ripple life, FIT rate and end-of-life criteria for the mission profile on request.

  5. Specify terminals, safety and assembly

    Specify W/H/T, pitch, two- or four-pin layout, lead diameter and length, packing and marking for the part number. Define discharge and touch protection, creepage and clearance, mechanical support, wave soldering, cleaning, coating and vibration acceptance.

Approvals & reliability

Reliability tests

Initial dissipation factor, insulation resistance and voltage proof are specified, together with voltage derating and dimension tables. ESR, ESL, ripple-current, thermal, THB and lifetime data on request.

TestConditionAcceptance
Initial characteristicstan δ ≤0.2% at 1 kHz / 1 Vrms / 20 °C; IR ≥10 GΩ at 100 VDC / 60 s / 20 °CMeasurement details on request
Voltage proof, terminal to terminal1.5 × UR, 10 sRamp, trip current and post-test ΔC, tan δ, IR and visual criteria on request
Design notes

Design from ripple spectrum and hot spot

DC-link voltage alone does not select the part. Sum harmonic currents using part-level ESR, include terminal current and cooling, and verify the measured hot spot against the life model for the part.

Account for stored energy and the discharge path

Use E = ½CV² for every operating and fault condition. Define precharge, bleeder or discharge, residual voltage, service isolation and short-circuit protection outside the capacitor.

Maximum capacitance depends on voltage

The series reaches 180 µF only at 500 V; at 1,200 V the maximum is 25 µF. Select from the voltage/capacitance table.

Treat humidity and life as selection parameters

For solar, wind, storage and industrial service, request THB data with applied bias, a voltage, hot-spot and ripple life model, and post-test capacitance, ESR/loss, IR and visual limits.

Minimize loop inductance

Two- and four-pin versions can differ in ESL and current sharing. Use the terminal drawing and impedance data for the part; keep busbar and PCB commutation loops short and symmetric.

Support the case and control solder heat

Large cases need mechanical restraint and vibration validation. Do not reflow-solder; use the wave- or hand-soldering profile specified for the part, and validate cleaning, coating, lead stress and thermal cycling.

Part numbering

Example ordering code. Not every combination is available.

3D · 2K · 106 · J · L · M · B0 · 420 · 450 · 220 · E · V · T

CodeMeaning
3DMC3D PCB-mount DC-link series code
2KRated voltage: 2K = 800 VDC; 1X = 900, 2H = 500 VDC; other voltage codes on request.
106Capacitance code: 106 = 10 µF; 105 = 1 µF, 107 = 100 µF
JCapacitance tolerance: J = ±5%; K = ±10%
LLead pitch: L = 37.5 mm; V = 27.5, I = 52.5 mm
MTerminal style: M = four-pin lead; E = single terminal, F = double terminal, K = upright screw terminal (drawings on request)
B0Lead length: B0 = 20.0 mm
420Body width: 420 = 42.0 mm
450Body height: 450 = 45.0 mm
220Body thickness: 220 = 22.0 mm
EEnvironmental: E = RoHS; F = RoHS + halogen-free
VSTE internal management code
TSTE internal management code