Not an X/Y safety capacitor
The series has no IEC 60384-14 safety class and no agency approval. Where the equipment standard requires a safety capacitor, use a certified X or Y capacitor.
CBB23B-THB
CBB23B-THB Series Box-Type Metallized Polypropylene Film Capacitors (THB)
| Humidity type | 85 °C / 85% RH (double-85) |
|---|---|
| Rated voltage | 350 / 400 VAC |
| Capacitance | 0.0022–1.0 µF |
| Tolerance | ±5% / ±10% |
| Lead spacing | 10 / 15 / 22.5 / 27.5 mm |
| Operating temperature | −40 °C to +105 °C |
Boxed metallized polypropylene film capacitors for high-voltage, high-frequency pulse circuits; moisture-resistant double-85 type (85 °C / 85% RH). 350 / 400 VAC, 2.2 nF–1 µF.
Part numbers
Part-number list on request. Download the datasheet or send us your specification.
Send your specificationDatasheets & approval documents
Datasheets, technical documents and approval certificates for this series. English editions of documents marked “Chinese” are available on request.
Engineering details
Overview
Metallized polypropylene film capacitors with internal series construction for high-voltage, high-frequency pulse circuits and electronic lighting. Self-healing film in a resin-sealed plastic box; moisture-resistant double-85 type. Rated 350 / 400 VAC, 0.0022–1.0 µF, J ±5% or K ±10%. Lead spacing 10–27.5 mm. Operating temperature −40 °C to +105 °C.
Series features
- Internal series construction with self-healing metallized polypropylene film
- Rated 350 / 400 VAC, 0.0022–1.0 µF
- Lead spacing 10, 15, 22.5 and 27.5 mm
- Dissipation factor tan δ ≤0.1% at 1 kHz
- Moisture-resistant double-85 type (85 °C / 85% RH); THB test data on request
Specifications
| Product type | High-voltage AC and pulse film capacitor; not an IEC 60384-14 X/Y safety capacitor |
|---|---|
| Winding construction | Internal series |
| Dielectric and encapsulation | Metallized polypropylene film, self-healing · resin-sealed plastic box |
| Rated AC voltage | 350 · 400 VAC |
| Capacitance range | 0.0022–1.0 µF |
| Capacitance tolerance | J ±5% · K ±10% |
| Operating temperature | −40 °C to +105 °C |
| Climatic category | 40/100/21 |
| Use above 100 °C | Voltage and current derating above 100 °C on request |
| Dissipation factor | tan δ ≤0.1% at 1 kHz, 1.0 Vrms, 20 °C |
| Insulation resistance | ≥50,000 MΩ at 100 VDC, 60 s, 20 °C |
| Voltage proof, terminal to terminal | 1.6 × UR for 5 s |
| Humidity type | Double-85 (85 °C / 85% RH), moisture-resistant |
| Resin flammability | UL 94 V-0 (encapsulation resin; not a component safety approval) |
| Body dimensions | W 13–32 · H 9–33 · T 4–18 mm, depending on voltage, capacitance and lead spacing |
| Lead spacing | 10 · 15 · 22.5 · 27.5 mm |
| Lead diameter | 0.6 mm at 10 mm spacing · 0.8 mm at 15–27.5 mm spacing |
| Lead forms and packing | Long straight · inner-bent · straight taped · bent taped |
| Taping | Tape dimensions specified for P = 10 / 15 / 20 or 22.5 mm; 27.5 mm and bulk packing quantities on request |
| Soldering profile, PP | Preheat Tp ≤110 °C · soldering Ts ≤120 °C for ≤15 s |
| Soldering profile, PE | Preheat Tp ≤125 °C · soldering Ts ≤160 °C for ≤15 s |
| Hand soldering | Iron ≤350 °C · ≤3 s · ≥2 mm from the coating |
| Reflow soldering | Not permitted; film shrinkage can degrade performance |
| Storage temperature | 15–35 °C |
| Further data | On request: permissible AC voltage versus frequency and temperature derating · DC rating · dV/dt · peak and RMS current · ESR · ESL · self-heating · THB bias voltage, duration and post-test ΔC, tan δ and IR limits · storage humidity and shelf life · endurance, overload, thermal-cycle, vibration and lead-strength test results |
Variants
Ranges by dielectric, package and lead style within this series.
| Variant | Body dimensions | Rated voltage / capacitance | Dielectric / tolerance | Lead / land pattern | Notes |
|---|---|---|---|---|---|
| N · 10 mm | W 13 · H 9–12 · T 4–6 mm | 350 / 400 VAC · 0.0022–0.022 µF | Metallized PP · J/K | P 10 ±1.0 · d 0.6 ±0.05 mm | Smallest lead spacing; low capacitance values for high-frequency duty. |
| Q · 15 mm | W 18 · H 11–19 · T 5–11 mm | 350 / 400 VAC · 0.01–0.12 µF | Metallized PP · J/K | P 15 ±1.0 · d 0.8 ±0.05 mm | Low to medium capacitance; pulse and thermal ratings on request. |
| T · 22.5 mm | W 26.5 · H 15–23 · T 6–13 mm | 350 / 400 VAC · 0.047–0.47 µF | Metallized PP · J/K | P 22.5 ±1.0 · d 0.8 ±0.05 mm | Larger body for pulse duty; dV/dt, current and self-heating data on request. |
| V · 27.5 mm | W 31.5–32 · H 20–33 · T 11–18 mm | 350 / 400 VAC · 0.15–1.0 µF | Metallized PP · J/K | P 27.5 ±1.0 · d 0.8 ±0.05 mm | Highest capacitance; support the body on the board. Lifetime data on request. |
Selection guide
Define the AC waveform, frequency and pulse stress first. Then select rated voltage, capacitance and lead spacing, and check pulse, humidity and temperature-derating data for the selected part.
Define the circuit position
Define the AC waveform, frequency, pulse repetition rate and the applicable equipment standard. The series has no X/Y safety approval; do not use it as a safety capacitor.
Confirm voltage rating and derating
Request the permissible AC voltage versus frequency, any DC rating and the temperature derating for the selected part. The 350/400 VAC rating alone does not define pulse capability.
Calculate pulse current and self-heating
Request dV/dt, peak and RMS current, ESR, ESL and thermal-resistance limits, and validate the actual ballast, resonant or snubber waveform on the application PCB.
Check humidity performance
Double-85 means 85 °C / 85% RH. Request the THB bias voltage, duration and post-test limits and compare them with the mission profile.
Specify dimensions, soldering and packing
Map the capacitance to W/H/T, lead spacing, lead diameter, lead form and packing. Validate the soldering profile for the dielectric; reflow soldering is not permitted.
Design notes
Internal series construction
Voltage sharing, ESL and failure mode depend on the internal series design; data for the selected part on request.
Pulse duty needs waveform data
The 350/400 VAC rating does not define dV/dt, peak current, repetition rate or resonant stress. Validate the actual ballast or snubber waveform against the limits of the selected part.
Control temperature rise, not ambient alone
Design with ESR versus frequency, RMS current, thermal resistance, ambient temperature, airflow and hot-spot limits. Validate self-heating in the final enclosure and apply voltage and current derating.
Humidity rating
Double-85 denotes the moisture-resistant 85 °C / 85% RH type. For humid service, request the THB test report and compare it with the mission profile.
Assembly
Specify body size, lead spacing, lead form, packing, soldering profile, cleaning and coating for each part number. Reflow soldering is not permitted. Support 27.5 mm bodies on the board.
Part numbering
Example ordering code. Not every combination is available.
4B · 2J · 334 · J · Q · 1 · B0 · 180 · 145 · 085 · E · S · 8
| Code | Meaning |
|---|---|
| 4B | Series code: CBB23B |
| 2J | Rated voltage code: R2 = 350 VAC, G2 = 400 VAC (for code 2J in the example, see the datasheet) |
| 334 | Capacitance code: 334 = 330 nF |
| J | Capacitance tolerance: J = ±5%, K = ±10% |
| Q | Lead spacing: N = 10 mm, Q = 15 mm, T = 22.5 mm, V = 27.5 mm |
| 1 | Lead form: 1 = long straight, 2 = inner-bent, 5 = straight taped, 6 = bent taped |
| B0 | Lead length code: B0 = 20.0 mm |
| 180 | Body width: 180 = 18.0 mm |
| 145 | Body height: 145 = 14.5 mm |
| 085 | Body thickness: 085 = 8.5 mm |
| E | Environmental code: E = RoHS, F = RoHS + halogen-free |
| S | Code position assigned by STE |
| 8 | STE internal management code |