Reflow and moisture handling
MSL 3. Store at ≤30 °C / 60% RH and use within six months of delivery. Complete soldering within 168 h after opening the bag. If storage time or floor life is exceeded, bake at 60 °C for 168 h. Reference reflow window: 230–260 °C for 10–30 s, preheat 170 °C max.
